| production capability and future development |
| |
project |
current production capacity |
expected production capacity in the future |
| |
board area |
double sided board: 21,000 m2/per month
multiple-layer board: 9,000 m2/per month |
double sided board: 40,000 m2/per month
multiple-layer board: 20,000 m2/per month |
| |
size of the board |
510mm ¡Á 635mm |
610mm ¡Á 760mm |
| |
max layers |
8 |
18 |
| |
board thickness (max)
board thickness (min) |
3.6mm
0.2mm |
3.6mm
0.1mm |
| |
size of machine drilling hole (min)
size of laser drilling hole(min) |
0.3mm
|
0.2mm
0.1mm |
| |
drilled hole tolerance |
pth¡À0.076mm
npth¡À0.05mm |
pth¡À0.05mm
npth¡À0.025mm |
| |
outline tolerance |
punch¡À0.15mm
punch¡À0.15mm |
punch¡À0.10mm
punch¡À0.10mm |
| |
aspect ratio |
6:1 |
8:1 |
| |
line width/line spacing |
3mil/3mil |
2mil/2mil |
| |
layer to layer registration tolerance |
3mil |
2mil |
| |
solder mask plug hole |
diameter:hole diameter: 20mil |
diameter:hole diameter: 28mil |
| |
solder mask bridge |
4mil |
3mil |
| |
multiple-layer board:copper foil ( inside layer)
(outside layer) |
2 oz
3 oz |
3 oz
4 oz |
| |
double sided board: copper foil |
3 oz |
4 oz |
| |
blind hole /buried hole |
yes |
yes |
| |
technologies |
 hal
osp
chemical electroless gold
gold plating
gold finger plating(tab plating)
carbon mask
chemical electroless silver
chemical electroless tin
peelable mask (blue gum)
jumping v-cut |
hal
osp
chemical electroless gold
gold plating
gold finger plating(tab plating)
carbon mask
chemical electroless silver
chemical electroless tin
peelable mask (blue gum)
jumping v-cut
selective hard gold planting
selective electroless gold |
| |
environmental protection procedure |
osd
electroless gold
flash gold
electroless silver
electroless tin |
non-lead procedure
halogen-free chemical compound |
